Advancements in rad hard hermetic packaging

You can benefit directly from decades of "lessons learned" in real-world applications in space on the latest advancements in hermetic packages for power devices in a rad hard environment.

This application note will describe the challenges of thermal mismatch and share the advancements in package design that help mitigate thermal stresses and ESD events in rad hard environments.

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Date: 1.8.2018

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